Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride

Aluminum nitride

Product name    Aluminum nitride
Character    White to pale yellow powder
Molecular weight    40.988
Boiling point    2517ºC
Storage condition    Dispose under dry protective gas to keep the reservoir sealed
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
  • Aluminum nitride
SPECIFICATION

The English name for "Aluminum nitride" is the same as its IUPAC name. An English alias for this compound is often abbreviated as "AlN," which stands for aluminum nitride. The use of IUPAC names is standard for precise chemical identification, but English aliases may also be used for convenience, especially in scientific and industrial contexts.Aluminum nitride (AlN) is a compound with the chemical formula AlN. This ceramic material exhibits exceptional thermal conductivity, electrical insulation properties, and mechanical strength. Widely utilized in various industries, Aluminum nitride is recognized for its applications in electronic devices, semiconductor packaging, and thermal management solutions.
Features:
High Thermal Conductivity:Exhibits excellent thermal conductivity, making it efficient in heat dissipation applications.Electrical Insulation:Maintains strong electrical insulation properties.Semiconductor Packaging:Widely used in semiconductor packaging to enhance thermal management.Dielectric Properties:Possesses favorable dielectric characteristics, suitable for electronic applications.Mechanical Strength:Offers robust mechanical strength, contributing to durability in various applications.Wide Bandgap:Features a wide bandgap, making it suitable for high-temperature and high-frequency applications.Aluminum nitrideAluminum nitride

Applications:

Thermal Management:Widely used in electronic and semiconductor devices for effective thermal management due to its high thermal conductivity.Semiconductor Packaging:Applied in semiconductor packaging to enhance thermal performance and reliability.LEDs and Power Electronics:Utilized in the manufacturing of LEDs and power electronic devices for efficient heat dissipation.Electronic Substrates:Used as a substrate material in electronic applications, providing electrical insulation and thermal stability.High-Frequency Components:Suitable for high-frequency applications due to its wide bandgap and dielectric properties.Aluminum nitride  ManufacturerAluminum nitride  Manufacturer